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TSMC ground-breaking ceremony: What Europe’s politicians hope for from the new plant

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Published: August 21st, 2024,
Last updated: September 10th, 2024

Ursula von der Leyen (CDU, l), EU-Kommissionspräsidentin, wird anlässlich eines symbolischen Spatenstichs auf dem künftigen Gelände einer Chipfabrik unter der Bezeichnung European Semiconductor Manufacturing Company (ESMC) von C.C. Wei (2.v.r), TSMC-Konzernchef, begrüßt. Die Produktion in der neuen Chipfabrik des taiwanesischen Chipherstellers TSMC soll 2027 beginnen.
TSMC CEO C.C. Wei welcomes EU Commission President Ursula von der Leyen to the groundbreaking ceremony for the TSMC plant in Saxony.

Taiwanese semiconductor giant TSMC broke ground Tuesday on a massive new plant in Dresden, its first in Europe and a marker of the continent’s newfound chip ambitions. The factory – formally called European Semiconductor Manufacturing Company – is a collaboration between TSMC and three established European partners: Infineon, Bosch, and NXP. 

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